As advances in AI technology drive rapid growth in memory demand, global collaboration is becoming increasingly important to securing stable supply chains. In order to share its business direction and further strengthen their partnerships, SK hynix brought together key partners
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▲ HBM reduces the distance that data must travel within the same package as the GPU, while CPO improves data transfer efficiency across networks connecting multiple GPU systems.
▲ LPO retains the pluggable optical module architecture while eliminating the DSP inside the module, whereas NPO places optical engines close to the switch chip but outside its package.
▲ In the pluggable architecture on the left, electrical signals travel from the switch ASIC to the front-panel optical modules. In the CPO architecture on the right, the central switch ASIC and surrounding optical engines are placed on a common
▲ Silicon photonics directs light entering through an optical fiber into waveguides within a silicon photonic integrated circuit (PIC), where integrated components such as ring resonators, modulators, and photodetectors control the light. Within this small chip, electrical signals can be
▲ Copper is efficient over short distances, such as within semiconductor packages. However, as transmission speeds and distances increase, signal loss, heat generation, and repeater power consumption also rise, making optical interconnects that carry multiple wavelengths through a single fiber
▲ No matter how many computing devices an AI factory has, GPUs will be left waiting for data if the data transfer pathways are too narrow.
AI doesn’t wait. The foundations of every industry are already cracking. This isn’t a story about one sector. Manufacturing. Finance. Healthcare. Data centers. The entire industrial order is being rebuilt around AI — and it’s happening now. Knowing about AI
Please use the link below to access the conference call. Email verification is required. https://irsvc.teletogether.com/hynix/hynix2026Q3_eng.php
▪ Reports revenues of 104.6155 trillion won, operating profit of 83.3338 trillion won, net profit of 39.7756 trillion won; Quarterly sales surpass 100 trillion won for the first time ▪ Sales of HBM4 and high-value-added server products expanded; HBM4 expected
▪ Solidigm has explored various funding options, including a potential IPO, to finance a new fab in the U.S. to meet growing AI memory demand. ▪ While an IPO was expected to ease investment burdens and expand capacity for shareholder
AI is no longer defined by a single model or AI processor. For AI to operate effectively in real-world services and industrial applications, it takes faster compute, wider memory bandwidth, higher-performance networks, more efficient storage, and more stable power and
Dear All, SK hynix Inc. will present its Third quarter earnings of 2026 on October. 28th, 2026 (Wed.). Announcement of the earnings in a press release will be made before 9:00 a.m. of the day. The conference call will be
As AI workloads evolve toward inference and agentic AI, the criteria for system performance are also changing. Computing power alone is no longer enough. Where data is stored, how quickly it moves, and how efficiently it is processed now have
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