News Highlights Seoul, May 26, 2026 – SK hynix Inc. (or “the company”, www.skhynix.com) announced today the launch of the iHBM solution that embeds integrated cooling elements(ICEs)1 within the high-bandwidth memory(HBM) package for next-generation HBM products. 1ICE(Integrated Cooling Elements): A cooling element made of electrically non-conductive, thermally conductive silicon-based material, designed to dissipate heat from the HBM package […] The post SK hynix unveils ‘iHBM’ thermal solution to boost AI performance first appeared on SK hynix Newsroom .